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Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology
Author	Andrew B. Kahng, Seokhyeong Kang, Seungwon Kim, Kambiz Samadi and Bangqi Xu
Journal	Proc. Design, Automation and Test in Europe
Impact factor	to appear
Year	2019
Category
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이전글Timing Verification for Latch-controlled VLSI Synchronous Systems 18.12.27
다음글An optimal gate design for the synthesis of ternary logic circuits 18.12.27