Conference
CAD & SoC Design Laboratory

Conference

SpectraPlace2.5D: Thermal-aware Chiplet Placement via Topology-guided MILP and Spectral Thermal Modeling
Author Junyeong Seo, Hyunjung Cho, Hyunwoo Kim, Hyeonjae Lee, and Seokhyeong Kang
Journal 32st Asia and South Pacific Design Automation Conference (ASP-DAC)
Impact factor accepted
Year 2027
Category

Our submission to ASP-DAC 2027, "SpectraPlace2.5D: Thermal-aware Chiplet Placement via Topology-guided MILP and Spectral Thermal Modeling" authored by Junyeong Seo, Hyunjung Cho, Hyunwoo Kim, Hyeonjae Lee, and Seokhyeong Kang has been accepted.