Conference
CAD & SoC Design Laboratory

Conference

Improving the Process Variation Tolerability of Flip-Flops for UDSM Circuit Design
Author E. J. Hwang, W. Kim, and Y. H. Kim
Journal The 11th International Symposium on Quality Electronic Design (ISQED 2010), San Jose, CA, USA
Impact factor pp. 812 - 817
Year Mar. 22~24, 2010
Category
Link 관련링크 http://ieeexplore.ieee.org/search/srchabstract.jsp?tp=&arnumb… 305회 연결

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