Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models > Conference | 포항공대 CSDL

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Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models
Author	Seungwon Kim, Ki Jin Han, Seokhyeong Kang and Youngmin Kim
Journal	Proc. IEEE International SoC Design Conference
Impact factor	pp. 124-125
Year	2014
Category
Link	https://ieeexplore.ieee.org/document/7087604 0회 연결
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