Conference
CAD & SoC Design Laboratory

Conference

Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology
Author Andrew B. Kahng, Seokhyeong Kang, Seungwon Kim, Kambiz Samadi and Bangqi Xu
Journal IEEE/ACM Design, Automation and Test in Europe Conference and Exhibition (DATE)
Impact factor
Year 2019
Category
Link 관련링크 https://ieeexplore.ieee.org/document/8715046 0회 연결

Our submission to DATE 2018, "Power Delivery Pathfinding for Emerging Die-to-Wafer Integration Technology" authored byAndrew B. Kahng, Seokhyeong Kang, Seungwon Kim, Kambiz Samadi and Bangqi Xu has been accepted.