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CAD & SoC Design Laboratory

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Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models
Author Seungwon Kim, Ki Jin Han, Seokhyeong Kang and Youngmin Kim
Journal Proc. IEEE International SoC Design Conference
Impact factor pp. 124-125
Year 2014
Category
Link 관련링크 https://ieeexplore.ieee.org/document/7087604 3회 연결

Our submission to ISOCC 2014, "Analysis and Reduction of Voltage Noise of Multi-layer 3D IC with PEEC-based PDN and Frequency-dependent TSV models" authored by Seungwon Kim, Ki Jin Han, Seokhyeong Kang and Youngmin Kim has been accepted.