Our submission to ASP-DAC 2027, "SpectraPlace2.5D: Thermal-aware Chiplet Placement via Topology-guided MILP and Spectral Thermal Modeling" authored by Junyeong Seo, Hyunjung Cho, Hyunwoo Kim, Hyeonjae Lee, and Seokhyeong Kang has been accepted.
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작성자 최고관리자 댓글 0건 조회 131회 작성일 26-09-04 13:43본문
Our submission to ASP-DAC 2027, "SpectraPlace2.5D: Thermal-aware Chiplet Placement via Topology-guided MILP and Spectral Thermal Modeling" authored by Junyeong Seo, Hyunjung Cho, Hyunwoo Kim, Hyeonjae Lee, and Seokhyeong Kang has been accepted.
- 이전글Our submission to ASP-DAC 2027, "AESPA: Algorithm-Hardware Co-Designed Early-Termination and Sparsity-Aware Processing Architecture" authored by DongHwan Yoon, JoonSeok Kim, and Seokhyeong Kang has been accepted. 26.10.02
- 다음글Our submission to ASP-DAC 2027, "Phase-Aware Monte Carlo Tree Search with LLM-Guided Proposal for Multi-Objective Physical Design Tuning" authored by Jongho Yoon, Jeonghyun Choi, Jaemin Seo and Seokhyeong Kang has been accepted. 26.09.04
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