Our submission to ASP-DAC 2027, "SpectraPlace2.5D: Thermal-aware Chiplet Placement via Topology-guided MILP and Spectral Thermal Modeling" authored by Junyeong Seo, Hyunjung Cho, Hyunwoo Kim, Hyeonjae Lee, and Seokhyeong Kang has been accepted.
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Our submission to ASP-DAC 2027, "SpectraPlace2.5D: Thermal-aware Chiplet Placement via Topology-guided MILP and Spectral Thermal Modeling" authored by Junyeong Seo, Hyunjung Cho, Hyunwoo Kim, Hyeonjae Lee, and Seokhyeong Kang has been accepted.
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